Asia Pacific’s printed circuit board market is anticipated to grow with the highest CAGR of 3.75% over the forecast years of 2018-2026. The region contributed the highest revenue in the year 2017 to the global PCB market and is expected to maintain its supremacy throughout the projected years. The markets of China, Japan, India, South-Korea and rest of Asia-Pacific are researched for this region.

ASIA PACIFIC PRINTED CIRCUIT BOARD (PCB) MARKET FORECAST 2018-2026

Asia Pacific Printed Circuit Board Market Is Segmented by Raw Materials(Epoxy Resin, Glass Fabric, Phenolic Resin, Kraft Paper) by Substrate (Standard Multilayer, Flexible Circuits, High-density Interconnect), Ic, Rigid 1-2 Sided, Rigid Flex) by Application (Communications, Consumer Electronics, Industrial Electronics, Automotive, Military) & by Geography

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Asia Pacific’s printed circuit board market is anticipated to grow with the highest CAGR of 3.75% over the forecast years of 2018-2026. The region contributed the highest revenue in the year 2017 to the global PCB market and is expected to maintain its supremacy throughout the projected years.

The markets of China, Japan, India, South-Korea and rest of Asia-Pacific are researched for this region. Factors like increasing market demand for eco-friendly printed circuit boards and the rapidly expanding semiconductor market is augmenting the market demand in APAC. The Chinese market contributed to the largest revenue share in 2017 as the country boasts of the largest PCB production base in the world. However, it is the Indian market which is predicted to register the highest CAGR over the forecast years. Although the APAC market is predicted to enjoy the highest revenue collections in the global market, factors like increasing raw material costs and fragmented nature of the industry are challenging the market growth.

Some of the eminent market players in this region are Samsung Electronics Inc, Epitome Components Ltd, Young Poong Electronics Co. Ltd, Zhen Ding Technology Holding Ltd, Isu Petasys, Nippon Mektron Ltd, Daeduck Electronics, Nanya Pcb Inc, AT&S, Shennan Circuits, Hewlett-Packard Company, Ascent Circuit Private Limited, TTM Technologies, Oki Printed Circuits Co. Ltd, Ibiden Inc, Unimicron Technology Corp, Hannstar Board Technology, Tripod Technology Corporation, and Compeq Ltd.

 

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    1. RESEARCH SCOPE
      • STUDY GOALS
      • SCOPE OF THE MARKET STUDY
      • WHO WILL FIND THIS REPORT USEFUL?
      • STUDY AND FORECASTING YEARS
    2. RESEARCH METHODOLOGY
      • SOURCES OF DATA
        • SECONDARY DATA
        • PRIMARY DATA
      • TOP-DOWN APPROACH
      • BOTTOM-UP APPROACH
      • DATA TRIANGULATION
    3. EXECUTIVE SUMMARY
      • MARKET SUMMARY
      • KEY FINDINGS
        • ASIA PACIFIC DOMINATES THE OVERALL PCB MARKET
        • EPOXY RESINS LEADS THE RAW MATERIAL SEGMENT
        • NEW TECHNOLOGIES PUSH REPLACEMENT DEMAND FOR ELECTRONICS
        • AUGMENTED DEMAND OF ECO-FRIENDLY PRINTED CIRCUIT BOARDS
    1. MARKET DYNAMICS
      • ETYMOLOGY OF PRINTED CIRCUIT BOARDS
      • MARKET DEFINITION
      • MARKET DRIVERS
        • SMART ELECTRONICS DEMAND ON THE RISE
        • GROWING APPLICATIONS OF SEMICONDUCTORS
        • RISING USE OF ELECTRONICS IN DIVERSE APPLICATIONS
        • EXPLOSIVE RISE IN INTERNET USAGE
      • MARKET RESTRAINTS
        • COMPETITION LEADING TO FALLING PRICES
        • VOLATILITY IN RAW MATERIAL PRICING
        • REGULATIONS ON E-WASTE
      • MARKET OPPORTUNITIES
        • INTERCONNECTED DEVICES USING IOT OFFERING GROWTH OPPORTUNITIES
        • EMERGING MARKET DEMAND
      • MARKET CHALLENGES
        • FRAGMENTED INDUSTRY AND RISING COMPETITION
        • RISE IN PRICE OF RAW MATERIAL
    1. MARKET BY RAW MATERIALS
      • EPOXY RESIN
      • GLASS FABRIC
      • PHENOLIC RESIN
      • KRAFT PAPER
      • OTHER RAW MATERIALS
    2. MARKET BY SUBSTRATE
      • STANDARD MULTILAYER
      • FLEXIBLE CIRCUITS
      • HIGH-DENSITY INTERCONNECT (HDI)
      • INTEGRATED CIRCUIT (IC’S)
      • RIGID 1-2 SIDED
      • RIGID FLEX
    3. MARKET BY APPLICATION
      • COMMUNICATIONS
      • CONSUMER ELECTRONICS
      • INDUSTRIAL ELECTRONICS
      • AUTOMOTIVE
      • MILITARY
      • OTHER APPLICATIONS
    4. KEY ANALYTICS
      • PORTER’S FIVE FORCE ANALYSIS
        • THREAT OF NEW ENTRANTS
        • THREAT OF SUBSTITUTE
        • BARGAINING POWER OF SUPPLIERS
        • BARGAINING POWER OF BUYERS
        • INTENSITY OF COMPETITIVE RIVALRY
      • LEGAL, POLICY AND REGULATORY FRAMEWORK
      • OPPORTUNITY MATRIX
      • VENDOR LANDSCAPE
      • MANUFACTURING PROCESS OF PCB
      • VALUE CHAIN ANALYSIS
        • RESIN & FIBER SUPPLIERS
        • LAMINATORS & MANUFACTURERS
        • DISTRIBUTORS AND RETAILERS
        • END-USERS
      • KEY BUYING CRITERIA
        • APPLICATION
        • RELIABILITY
        • COST
    1. GEOGRAPHICAL ANALYSIS
      • CHINA
      • JAPAN
      • INDIA
      • SOUTH KOREA
      • REST OF ASIA PACIFIC
    2. COMPETITIVE LANDSCAPE
      • MARKET SHARE ANALYSIS
      • KEY COMPANY ANALYSIS
      • CORPORATE STRATEGIES
        • PRIMARY STRATEGY: ACQUISITION
        • SECONDARY STRATEGY: COLLABORATION
        • LIST OF KEY COMPETITIVE STRATEGIES
      • COMPANY PROFILES
        • ASCENT CIRCUIT PRIVATE LIMITED
        • AT&S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
        • COMPEQ LTD
        • DAEDUCK ELECTRONICS
        • EPITOME COMPONENTS LTD.
        • HANNSTAR BOARD CORPORATION
        • HEWLETT-PACKARD COMPANY
        • IBIDEN INC.
        • ISU PETASYS
        • NAN YA PCB CORPORATION
        • NIPPON MEKTRON, LTD.
        • OKI PRINTED CIRCUITS CO. LTD.
        • SAMSUNG ELECTRONICS INC
        • SHENNAN CIRCUITS
        • TRIPOD TECHNOLOGY CORPORATION
        • TTM TECHNOLOGIES
        • UNIMICRON TECHNOLOGY CORP
        • YOUNG POONG ELECTRONICS CO. LTD
        • ZHEN DING TECHNOLOGY HOLDING LTD

     

    LIST OF TABLES

    TABLE 1: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY COUNTRY, 2018-2026 (IN $ BILLION)

    TABLE 2: SOME ELECTRONIC DEVICES SALES GROWTH FOR THE YEAR 2015 & 2023

    TABLE 3: INTERNET USERS BY REGION (IN %)

    TABLE 4: WASTE GENERATED FROM MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING PROCESS

    TABLE 5: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY RAW MATERIALS, 2018-2026 (IN $ BILLION)

    TABLE 6: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY SUBSTRATE, 2018-2026 (IN $ BILLION)

    TABLE 7: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY APPLICATION, 2018-2026 (IN $ BILLION)

    TABLE 8: LEGAL, POLICY & REGULATORY FRAMEWORK

    TABLE 9: OPPORTUNITY MATRIX

    TABLE 10: VENDOR LANDSCAPE

    TABLE 11: ASIA PACIFIC PRINTED CIRCUIT BOARDS MARKET, BY COUNTRY, 2018-2026 (IN $ BILLION)

    TABLE 12: PRODUCTION OF ELECTRONICS AND IT-ITES INDUSTRY (VALUE IN RS CRORE)

    TABLE 13: LIST OF KEY COMPETITIVE STRATEGIES IN PRINTED CIRCUIT BOARDS MARKET

    LIST OF FIGURES

    TABLE 1: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY COUNTRY, 2018-2026 (IN $ BILLION)

    TABLE 2: SOME ELECTRONIC DEVICES SALES GROWTH FOR THE YEAR 2015 & 2023

    TABLE 3: INTERNET USERS BY REGION (IN %)

    TABLE 4: WASTE GENERATED FROM MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING PROCESS

    TABLE 5: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY RAW MATERIALS, 2018-2026 (IN $ BILLION)

    TABLE 6: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY SUBSTRATE, 2018-2026 (IN $ BILLION)

    TABLE 7: ASIA PACIFIC PRINTED CIRCUIT BOARD MARKET, BY APPLICATION, 2018-2026 (IN $ BILLION)

    TABLE 8: LEGAL, POLICY & REGULATORY FRAMEWORK

    TABLE 9: OPPORTUNITY MATRIX

    TABLE 10: VENDOR LANDSCAPE

    TABLE 11: ASIA PACIFIC PRINTED CIRCUIT BOARDS MARKET, BY COUNTRY, 2018-2026 (IN $ BILLION)

    TABLE 12: PRODUCTION OF ELECTRONICS AND IT-ITES INDUSTRY (VALUE IN RS CRORE)

    TABLE 13: LIST OF KEY COMPETITIVE STRATEGIES IN PRINTED CIRCUIT BOARDS MARKET

    1. GEOGRAPHICAL ANALYSIS
      • CHINA
      • JAPAN
      • INDIA
      • SOUTH KOREA
      • REST OF ASIA PACIFIC
    2. MARKET BY RAW MATERIALS
      • EPOXY RESIN
      • GLASS FABRIC
      • PHENOLIC RESIN
      • KRAFT PAPER
      • OTHER RAW MATERIALS
    3. MARKET BY SUBSTRATE
      • STANDARD MULTILAYER
      • FLEXIBLE CIRCUITS
      • HIGH-DENSITY INTERCONNECT (HDI)
      • INTEGRATED CIRCUIT (IC’S)
      • RIGID 1-2 SIDED
      • RIGID FLEX
    4. MARKET BY APPLICATION
      • COMMUNICATIONS
      • CONSUMER ELECTRONICS
      • INDUSTRIAL ELECTRONICS
      • AUTOMOTIVE
      • MILITARY
      • OTHER APPLICATIONS

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